The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2001
Filed:
Dec. 01, 1999
Peter Joseph Sinkunas, Canton, MI (US);
Andrew Zachary Glovatsky, Plymouth, MI (US);
Bernard Allen Meyer, Taylor, MI (US);
Zhong-You Joe Shi, Ann Arbor, MI (US);
Myron Lemecha, Dearborn Heights, MI (US);
Rexanne M. Coyner, Farmington Hills, MI (US);
Visteon Global Technologies, Inc., Dearborn, MI (US);
Abstract
There is disclosed herein a method for laser soldering, comprising the steps of: (a) providing an electronic component,having at least two terminations thereon; a dielectric substrate,having a first surface,on a first side thereof, a second surface on a second side thereof, and at least two mounting pads,arranged on the first surface,in matched relation with the terminations of the electronic component,; and a diode laser,; (b) depositing solder paste atop the mounting pads,; (c) placing the electronic component,atop the substrate,such that each termination rests generally atop its respective mounting pad,; and (d) directing laser energy,from the diode laser,to at least one of the mounting pads,from the second side of the substrate,for a predetermined time, such that the solder paste atop the at least one of the mounting pads,is melted.