The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2001
Filed:
Mar. 24, 2000
Takayuki Naba, Chigasaki, JP;
Nobuyuki Mizunoya, Yokohama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
The present invention provides a ceramic circuit board including: a ceramic substrate; a plurality of metal circuit plates bonded to a surface of the ceramic substrate; and parts including semiconductor element integrally bonded to a surface of the metal circuit plates through a solder layer, wherein at least peripheral portion of one metal metal circuit plate to which the parts are solder-bonded and is adjacent to the other metal circuit plates is formed with a projection for preventing solder-flow. According to the structure described above, there can be provided a ceramic circuit board which is free from short-circuit due to the solder-flow or bonding defects of the parts thereby to have an excellent operating reliability, and is capable of being easily mass-produced with a high production yield.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile