The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2001
Filed:
Mar. 14, 2000
Kohji Shinomiya, Itami, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A method of producing a packaged semiconductor chip including hardened resin packaging and a polished electrode includes producing an electrode on a first surface of a semiconductor substrate; depositing a glass layer on the first surface of the semiconductor substrate but not on the electrode; depositing a resin layer on the glass layer; curing the resin layer on the glass layer; polishing an external surface of the electrode and the resin layer so that the external surface and the resin layer, after polishing, are substantially planar, thereby producing a flip-chip package; mounting the flip-chip package on a printed circuit board via the electrode; testing the flip-chip package on the printed circuit board; and removing the flip-chip package from the printed circuit board.