The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2001
Filed:
Mar. 26, 1999
Takanori Yamazaki, Ibaraki, JP;
Kiyoshi Watanabe, Ibaraki, JP;
Hitachi Cable Ltd., Tokyo, JP;
Abstract
Disclosed are a strippable semiconductive resin composition adapted for formation of a semiconductive layer having a volume resistivity of not more than 5000 &OHgr;·cm at room temperature, the composition comprising: a polymer component (a), with a number average molecular weight of not less than 3×10,or a weight average molecular weight of not less than 3×10,and a melting point of 60 to 80° C., composed mainly of an ethylene/vinyl acetate copolymer, or a polymer component (b) composed mainly of 99 to 50 parts by weight of the ethylene/vinyl acetate copolymer and 1 to 50 parts by weight of a polyolefin having a melting point of 120° C. or above; and conductive carbon black compounded with the polymer component (a) or (b), and a wire and cable comprising the strippable semiconductive resin composition as an outer semiconductive layer. By virtue of this construction, an outer semiconductive layer can be formed which is excellent in adhesion to an insulator crosslinked by silane grafting/water crosslinking, as well as in strippability.