The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2001
Filed:
Dec. 15, 1999
Applicant:
Inventors:
Assignee:
Victor Company of Japan, Ltd., Yokohama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 ;
U.S. Cl.
CPC ...
B05D 5/12 ;
Abstract
In a manufacturing method of a printed circuit board comprising a process of coating insulative thermosetting resin on a surface of a printed circuit board having a blind hole and a process of filling up the insulative thermosetting resin in the blind hole, the printed circuit board coated with the insulative thermosetting resin is kept in a low pressure atmosphere of 1.3 to 666 hPa, and then the insulative thermosetting resin is hardened, so that the insulative thermosetting resin is filled up in the blind hole appropriately.
Seki, Yasuaki. (2001). Manufacturing method of printed circuit board (U.S. Patent No. 6284308). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6284308
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile