The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2001
Filed:
Jul. 09, 1999
Takahiro Imamura, Kawasaki, JP;
Masaki Katayama, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method of electroplating using a photoresist layer on a conductive seed layer. The photoresist layer defines a column-shaped space. Ridges are formed on the wall surfaces of the photoresist layer surrounding the column-shaped space. The ridges extend from the conductive seed layer to the opening of the column-shaped space. The electrolytic solution drives bubbles out of the column-shaped space, so that the column-shaped space is filled with the electrolytic solution without any cavities. In addition, if hydrogen bubbles are generated in the column-shaped space, the electrolytic solution serves to drive the hydrogen bubbles out of the column-shaped space along the corners of the column-shaped space.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile