The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2001

Filed:

Nov. 16, 1999
Applicant:
Inventors:

Yasuhiko Sasaki, Niihari-gun, JP;

Yasuhiro Yoshimura, Niihari-gun, JP;

Akira Koide, Inashiki-gun, JP;

Ryo Miyake, Tsukuba, JP;

Naruo Watanabe, Niihari-gun, JP;

Takao Terayama, Ushiku, JP;

Hiroshi Mitsumaki, Mito, JP;

Yasuhiko Ishida, Hitachinaka, JP;

Tomonari Morioka, Hitachinaka, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F04B 1/700 ;
U.S. Cl.
CPC ...
F04B 1/700 ;
Abstract

A micro pump is made compact and can prevent members constituting the micro pump from being chemically reacted with a working fluid, and a method of producing the same. After each of substrates constituting the micro pump is formed by a member containing a silicone as a main composition and a plurality of metal membranes are formed on a whole of a bonding surface of each of the substrates so as to form bonding surfaces, the bonding surfaces are cleaned, and the bonding surfaces are opposed to each other under a vacuum condition, overlapped, heated and pressed so as to be bonded. The valve portion has a beam and a protrusion for sealing as provided in the valve side, whereby a pressure applied to the protrusion becomes smaller than the bonding pressure.


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