The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2001

Filed:

May. 28, 1999
Applicant:
Inventors:

Mikio Okamoto, Hanno, JP;

Katsumi Ebara, Wako, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

An electronic circuit device having an improved heat dissipating effect, a small size and a high reliability is provided with a metal substrate having a first surface and a second surface and a case. Electronic parts are mounted on only the first surface and the case is united with a radiating fin in one body. The metal substrate is installed in the case such that the metal substrate serves as a cap of the case and the first surface of the metal substrate faces to the case. A resin is provided to fill up a space between the metal substrate and the case, whereby heat generated from the electronic parts is dissipated to the exterior from both the radiating fin and the second surface of the metal substrate.


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Okamoto, Mikio. (2001). Electronic circuit device and method of fabricating the same (U.S. Patent No. 6282092). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6282092

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