The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2001
Filed:
Nov. 03, 1999
Walter Kodim, Nürnberg, DE;
Frank Bäuerlein, Winkelhaid, DE;
Telefonaktiebolaget LM Ericsson (publ), Stockholm, SE;
Abstract
The invention relates to an electrical component (CO) as well as a device (DEV) comprising such an electrical component (CO) and an electric circuit module (MO). A ground plane (,) of the component (CO) and a ground plane (,) of the circuit module (MO) are brought into contact via projections (,″) provided on the ground plane (,) of the component (CO) and/or on the ground plane of the circuit module (MO). The provision of the projections (,″) and the recesses (,′) therebetween provide heat sinks between the projections (,″) when they are soldered to the ground plane (,) of the circuit module (MO). Through-holes (,′) and additional non-ground conductors (,′) can be provided between pads (,) of the ground plane (,) of the circuit module (MO) allowing an efficient use of the available space. The invention is particularly useful when a patch antenna needing a large ground plane is connected to a multilayer circuit board. Another embodiment of the invention comprises a plurality of spacer elements which are arranged between the ground planes (,) of the circuit module (MO) and of the component (CO), such that the ground planes (,) can be kept flat. This allows a design of the configuration of the ground plane of the circuit module (MO) independently from a configuration of the component (CO).