The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2001
Filed:
Jul. 07, 1999
Toru Nishikawa, Yokohama, JP;
Masahide Harada, Yokohama, JP;
Kaoru Katayama, Hadano, JP;
Takeshi Miitsu, Hadano, JP;
Takayuki Uda, Hadano, JP;
Takahiro Daikoku, Ushiku, JP;
Hitachi, LTD, Tokyo, JP;
Abstract
A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is solder with the first metallized part.