The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2001
Filed:
Dec. 05, 1997
William L. Robbins, Newton Center, MA (US);
The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US);
Abstract
An integrated circuit (IC) header subassembly includes a spacer mounted to the header. The IC die assembly, consisting of an IC die or IC die carrier assembly, is mounted to spacer which is mounted to the header. The coefficient of thermal expansion of the spacer is selected to be between the coefficient of thermal expansion of the IC die assembly and the header minimize stresses due to thermal expansion and contraction. In addition, the spacer is substantially smaller in width and length and the IC die assembly and the header whereby the IC die assembly appears to be pedestal mounted. By minimizing the length of the contacting surfaces between the spacer and the IC die assembly, the risk of warping or cracking due to differences in thermal expansion can be reduced. This allows for much larger IC dies and pixel arrays to be used.