The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2001
Filed:
Mar. 24, 2000
Akira Takashima, Kawasaki, JP;
Fumihiko Ando, Kawasaki, JP;
Mitsuru Sato, Kawasaki, JP;
Takashi Suzuki, Kawasaki, JP;
Yoshikazu Kumagaya, Kawasaki, JP;
Kazunari Kosakai, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
External connection electrodes can be positively mounted on a substrate when the pitch between the external connection electrodes is reduced and the diameter of each through hole formed in the substrate is reduced. A semiconductor chip is mounted on a first surface of a tape substrate. Electrode films are formed on the first surface of the tape substrate, each of the electrode films electrically connected to the semiconductor chip. External connection electrodes are provided on a second surface of the tape substrate, each of the external connection electrodes connected to a respective one of the electrode films via a through hole formed in the tape substrate. The external connection electrodes are formed on the electrode films by plating. A diameter S,of a portion of each of the external connection electrodes protruding from the second surface of the tape substrate and a diameter S,of the through hole satisfy a relationship S,≦S