The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2001
Filed:
Jan. 26, 2000
Yasuharu Kameyama, Ibaraki, JP;
Norio Okabe, Ibaraki, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
A tape carrier is constituted comprising land,for solder ball, formed in a predetermined pattern on insulating film,having device hole,formed in the middle, leads,to be connected to a semiconductor chip, plating power-feeding lead,having one end connected to lead,and formed on insulating film,, and easily-broken part,provided in the middle of the power-feeding leads. A semiconductor device is constituted wherein tape carrier,is provided with plating power-feeding lead,formed on insulating film,, one end of which is drawn out of insulating film,, the other end being connected to leads,, and plating power-feeding lead,is disconnected from the leads when semiconductor chip,is installed. Thus, a tape carrier for BGA which is manufactured easily, capable of achieving higher density of wiring in the wiring pattern, improved in water-resistance and reliability, and a semiconductor device using the same are provided.