The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2001
Filed:
Jun. 14, 1999
Alvaro Maury, Orlando, FL (US);
John A. Maze, Orlando, FL (US);
Frank Miceli, Orlando, FL (US);
Jose Omar Rodriguez, Orlando, FL (US);
Robert M. Symons, Orlando, FL (US);
Agere Systems Guardian Corp., Orlando, FL (US);
Abstract
The present invention provides a wafer carrier for use with a semiconductor wafer polishing apparatus. In one embodiment, the wafer carrier comprises a carrying head having opposing first and second surfaces, a primary channel system formed in the second surface, and a secondary channel system formed in the second surface. The first surface is coupleable to the semiconductor polishing apparatus and the second surface is adapted to receive a semiconductor wafer to be polished. The primary channel system comprises first and second intersecting channels. The secondary channel system intersects the primary channel system so that the secondary channel system and the primary channel system cooperate to occupy a substantial portion of a surface area of the second surface. Therefore, the primary channel system and the secondary channel system decrease an amount of force required to remove the semiconductor wafer from the second surface.