The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2001

Filed:

Sep. 30, 1997
Applicant:
Inventors:

Haruyasu Mitzutani, Ama-gun, JP;

Junji Koizumi, Nagoya, JP;

Katsushi Ito, Nakashima-gun, JP;

Masato Kobayashi, Takatsuki, JP;

Mitsuhiro Isomichi, Takatsuki, JP;

Assignee:

Toyoda Gosei Co., Ltd., Aichi-Ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 5/16 ; B32B 1/800 ; B60R 1/300 ;
U.S. Cl.
CPC ...
B32B 5/16 ; B32B 1/800 ; B60R 1/300 ;
Abstract

The object of the present invention is to provide a colored resin composition having a uniform glitter feeling, which can prevent flow mark formation. In a resin composition molded by using a thermoplastic resin composition in which glitter material is mixed into a synthetic resin, said resin molded article must have a molding ratio L/T is not less than 100, wherein T is the thickness of the molded article and L is a distance from a gate position at molding to a remotest position on the molded article, and wherein said glitter material has average particle size d of 10 &mgr;m<d&lE;200 &mgr;m.


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