The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2001
Filed:
Dec. 29, 1998
David Cheng, Sunnyvale, CA (US);
Other;
Abstract
An electroplating apparatus includes a cathode structure, an anode structure, a power supply, and a pressurized electrolyte source. The cathode structure is configured to engage a perimeter portion of a workpiece such as a semiconductor wafer, and the anode structure includes an outlet. The power supply is coupled between the cathode structure and the anode structure. The pressurized electrolyte source is coupled to the anode structure to provide an electrically continuous fluid jet of an electrolyte from the outlet to be directed to a surface of the workpiece that is to be electroplated. A method for electroplating a workpiece includes electrically engaging a perimeter portion of the workpiece with a cathode structure, and directing an electrically continuous fluid jet of electrolyte having positively charged ions towards a surface of the workpiece that is to be electroplated. Preferably, there is a mechanism for providing relative motion between the workpiece and the jet of electrolytes, such as a mechanism for moving the electrically continuous fluid jet of electrolyte to a number of radial positions as the workpiece is rotated around an axis of rotation.