The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2001
Filed:
Jan. 18, 2000
Applicant:
Inventor:
Hsiao Che Wu, Chung-Li, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 1/00 ;
U.S. Cl.
CPC ...
B24B 1/00 ;
Abstract
An apparatus and method to polish a wafer using abrasive flow machining (AFM) is provided. Under a high-pressure condition, the wafer is polished by flowing abrasive media with high viscosity, on the wafer in order to planarize the wafer. Therefore, the polishing efficiency is higher, and the attained roughness is lower than the conventional method. In addition, the selectivity of this method is lower.
Quick Actions:
Wu, Hsiao. (2001). Apparatus and method to polish a wafer using abrasive flow machining (U.S. Patent No. 6280295). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6280295
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile