The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2001

Filed:

Aug. 13, 1997
Applicant:
Inventors:

Min-Chih Hsuan, Hsinchu City, TW;

Charlie Han, Hsinchu Hsien, TW;

Jerry Jaw, Chung Ho City, Taipei Hsien, TW;

Tung-Chi Liu, Nantou Hsien, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/750 ; G01R 3/126 ; G11C 2/900 ; H01L 2/166 ;
U.S. Cl.
CPC ...
G06F 1/750 ; G01R 3/126 ; G11C 2/900 ; H01L 2/166 ;
Abstract

A preburn-in DRAM module circuit board is provided, which allows a plurality of DRAM modules to be constructed directly thereon, and which can be directly connected to a large burn-in oven so as to perform a burn-in process concurrently on the DRAM modules mounted thereon to check for any defected IC chips that are to be reworked. After the burn-in process, each of the DRAM modules can be cut apart from the circuit board to serve as a single memory module. The preburn-in DRAM module circuit board allows the manufacturing process for the DRAM modules to be reduced in schedule and manufacturing cost. Material cost can also be saved since the burn-in circuit and the module circuit are arranged on the same circuit board.


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