The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2001

Filed:

Aug. 12, 1999
Applicant:
Inventor:

Hsin-Kuo Dai, Tu-Chen, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 3/08 ;
U.S. Cl.
CPC ...
H01P 3/08 ;
Abstract

A flexible printed circuit comprises a flexible insulative board having a first surface and a second surface opposite thereto. At least one conductive transmission line is formed on the first surface and comprises same length of a plurality of tested sections. Each tested section has an original characteristic impedance and the original characteristic impedance of each tested sections is beyond an acceptable tolerance to a standard value. A compensation region is defined at the second surface and separated into a plurality of compensation units having identical area. Each compensation unit is vertically related to a specific tested section of the at least one transmission line and having a conductive region and a non-conductive region. A final characteristic impedance of the tested section is obtained within an acceptable tolerance to the standard value due to compensation of the compensation unit.


Find Patent Forward Citations

Dai, Hsin-Kuo. (2001). Flexible printed circuit and the method for making the same (U.S. Patent No. 6278345). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6278345

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…