The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2001
Filed:
Jul. 26, 1999
Applicant:
Inventor:
Yoshihiro Tomita, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
Abstract
A semiconductor device includes semiconductor elements,and,which are connected through a conductor,The wiring layer,of the first semiconductor element,is externally extended through a small hole,formed on a wiring board,and filled with a conductive material, a wiring layer,of the second semiconductor element,and an external connecting terminal,The portion connecting the semiconductor elements exclusive of the back surfaces thereof are sealed by sealing material,In this configuration, the semiconductor device can be provided which includes semiconductor elements multi-layered to give advantages of low-profiling, compactness, high dissipation and low cost.