The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2001
Filed:
Jun. 28, 1999
Applicant:
Inventor:
Reading G. Maley, San Francisco, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/352 ;
U.S. Cl.
CPC ...
H01L 2/352 ;
Abstract
A flip-chip circuit arrangement having improved thermal management includes a base substrate having a top surface which includes one or more bond pads thereon. The arrangement further includes a semiconductor substrate having circuitry and one or more bond pads thereon, wherein the one or more bond pads on the semiconductor substrate correspond to the one or more bond pads on the base substrate. The semiconductor substrate has one or more channels which extend from a top surface to a bottom surface thereof and the channels facilitate a transfer of heat due to power dissipation of the circuitry away from the semiconductor substrate.