The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2001
Filed:
Jun. 04, 1998
Katsuji Matsuta, Sabae, JP;
Kazuyoshi Uchiyama, Takefu, JP;
Masahiko Kawaguchi, Takefu, JP;
Katsuhiro Misaki, Fukui, JP;
Naoki Iida, Sabae, JP;
Abstract
A method of manufacturing an electronic component provides a wide area which can be used for forming elements on the surface of a mother substrate and effectively produces an electronic component having excellent performance characteristics. At least a portion of the mother substrate is cut by using a blade having a shape in which a portion thereof butted against the boundary (shoulder) between the electrode arrangement surface and the cut end surface of the mother substrate or a portion which becomes the boundary (shoulder) is inclined at a predetermined angle to form an inclined surface at the boundary (shoulder) or the portion which becomes the boundary (shoulder) so as to expose a part of an electrode at the inclined surface.