The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2001
Filed:
Feb. 02, 2000
Applicant:
Inventors:
Masanori Mitsui, Fukuoka, JP;
Masanori Mikawa, Fukuoka, JP;
Assignee:
Mitsui High-Tech Inc., Fukuoka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/158 ; B29C 3/342 ; B29C 4/502 ;
U.S. Cl.
CPC ...
H01L 2/158 ; B29C 3/342 ; B29C 4/502 ;
Abstract
In the surface of a lower die,in a resin sealing mold, a region where an external leads,of a lead frame,and its peripheral regions having a width of 0.1 mm are mirror-finished to form a mirror-face region,The other region than the mirror-face region is subjected to discharging processing to form a satin-finished region,The resin-sealing mold having such a structure permits a package to be smoothly released and prevents resin from remaining.