The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2001
Filed:
Apr. 09, 1999
Hirotaka Ogawa, Komaki, JP;
Noda Screen Co., Ltd., Aichi, JP;
Abstract
A method of forming solder bumps on pads formed on a surface of a base material includes the steps of supplying solder to a template having a number of through holes formed to correspond to the pads of the base material respectively so that the through holes are filled with the solder, the template having an upper side and an underside, scraping the sides of the template with doctors to remove an excessive amount of solder, and opposing the template to the base material so that the pads are aligned with the through holes respectively, covering the side of the template opposite to the base material with a pressure housing and increasing pressure in an interior of the pressure housing so that a difference in pressure between an exterior and the interior of the pressure housing extrudes the molten solder from the template to the pad side of the base material.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile