The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2001

Filed:

Sep. 26, 1997
Applicant:
Inventors:

Hiroshi Takami, Nagoya, JP;

Teruo Imamaki, Kasugai, JP;

Hiroshi Taira, Ichinomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41K 1/50 ; B41J 2/345 ;
U.S. Cl.
CPC ...
B41K 1/50 ; B41J 2/345 ;
Abstract

Disclosed is the stamp device,in which the average pore diameter of the porous base plate used for the stamp plate,and the processed stamp plate,is set in a range of 10 &mgr;m-40 &mgr;m, the hardness of the stamp surface,is set in a range of 20°-50°, the thickness of the porous base plate is set in a range of 1 mm-4 mm, and the annealing temperature of the porous base plate is set in a range of 40° C.-60° C., thereby various stamping characteristics are improved.


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