Apparatus for gripping a plug of an ic package container during removal of the plug

Abstract

Pincher vises move towards each other for gripping a plug of an IC package container such that the IC package container may be pulled away from the plug. A first pincher vise is at a gripping position when the first pincher vise is gripping the plug and is at a freeing position when the first pincher vise is not gripping the plug. A second pincher vise is at a gripping position when the second pincher vise is gripping the plug and is at a freeing position when the second pincher vise is not gripping the plug. A pushing rod is coupled to the first pincher vise and the second pincher vise, and a motion translation mechanism moves the first pincher vise and the second pincher vise to the gripping position when the pushing rod is pushed down, and moves the first pincher vise and the second pincher vise to the freeing position when the pushing rod is no longer pushed down after the IC package container has been pulled away from the plug. In this manner, the pincher vises grip the plug of the IC package container such as an IC package tube such that the operator does not grip the plug as the operator pulls the IC package container away from the plug. During manufacture of a high quantity of IC packages, the operator is saved from the hand fatigue and hand pain of using a tweezer to repeatedly grip plugs of a high quantity of IC package tubes.