The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2001
Filed:
Sep. 14, 1999
Jun-Young Jeon, Seoul, KR;
Jong-Hyun Choi, Kyunggi-do, KR;
Abstract
Integrated circuit packages include an integrated circuit substrate having microelectronic devices therein and pads, wherein first ones of the pads are enabled to provide output data from the microelectronic devices, and wherein second ones of the pads are disabled to provide a reduced path width for the integrated circuit substrate. A packaging substrate includes terminals, a respective one of which is connected to a respective one of the pads, including the second ones of pads that are disabled to provide a reduced path width for the integrated circuit substrate. Accordingly, the same packaging substrates may be used with integrated circuit substrates having different path widths. In a preferred embodiment, the integrated circuit substrate includes a control circuit that disables the second ones of the pads to provide a reduced path width for the integrated circuit substrate. The control circuit preferably includes at least one fuse that disables the second ones of pads to provide the reduced path width for the integrated circuit substrate.