The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2001
Filed:
Jan. 13, 1998
Hiroaki Oshio, Kitakyushu, JP;
Iwao Matsumoto, Kitakyushu, JP;
Tsuguo Uchino, Kitakyushu, JP;
Hiroshi Nagasawa, Kitakyushu, JP;
Tadashi Umegi, Kitakyushu, JP;
Satoshi Komoto, Suginami-ku, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A semiconductor light emitting device includes a semiconductor light emitting element (,), a resin stem (,) having a recess (,), and a projection (,) made of a light-transmissive thermosetting resin on the resin stem so as to cover the entire upper surface and continuous upper part of side surfaces of the resin stem to a predetermined depth. The recess is filled with a light-transmissive resin encapsulating element (,) to embed the semiconductor light emitting element, one end of an externally extended first lead (,) and one end of an externally extended second lead (,) electrically connected to first and second electrodes of the semiconductor light emitting element, and a bonding wires (,) connecting the second lead to the second electrode. The projection functions as a lens and is made by hardening a fluid-state resin in an encapsulating case mold. Since the projection extends over the upper surface and upper part of side surfaces continuous from the upper surface, it is firmly bonded to the resin stem with a high adherability.