The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2001
Filed:
Nov. 30, 1999
Yasufumi Miyake, Osaka, JP;
Tetsuya Terada, Osaka, JP;
Kenkichi Yagura, Osaka, JP;
Chiharu Miyaake, Osaka, JP;
Toshihiko Sugimoto, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
The present invention provides a rigid circuit member obtained by bending a composite laminate comprising a circuit conductor made of a metal foil interposed between plastic films having an elastic modulus of not less than 450 kg/mm,with an adhesive, characterized in that as said plastic film there is used a polyethylene naphthalate film. The present invention also provides a circuit board adapted to be connected to a conductor on a rigid substrate, characterized in that said circuit conductor is interposed between polyethylene naphthalate films. The present invention further provides a printed circuit board, comprising a polyethylene naphthalate film having an elastic modulus of not less than 500 kg/mm,, not more than 1.5×10,/° C., a hygroscopic expansion coefficient of not more than 1.2×10,/%RH, a water vapor permeability of not more than 15 g/m,/mil day, a percent water absorption of not more than 2% and a melting point of not higher than 280° C. and a conductor circuit integrated into a laminate with an adhesive layer provided interposed therebetween.