The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2001
Filed:
Jun. 16, 1999
Neil Gordon Murray, Jr., Wixom, MI (US);
Geoffrey A. Wright, Clarkston, MI (US);
TRW Inc., Lyndhurst, OH (US);
Abstract
A stencil (,) facilitates application of solder material (,) to a circuit board (,) carrying a through-hole component (,) and to which a surface mount component is to be mounted. The stencil (,) has a first surface (,) and a second surface (,). The second surface (,) is engageable to a surface (,) of the circuit board (,) having a plurality of electrically conductive pads (,). At least one first aperture (,) is formed between the first and second surfaces (,)of the stencil (,). The stencil (,) has a first thickness (T,) adjacent the first aperture (,) for depositing a first amount of solder material (,) within the first aperture (,) and around a component lead (,) extending from the through-hole component (,) into the first aperture (,). At least one second aperture (44) is formed between the first and second surfaces (,) of the stencil (,). The stencil (,) has a second thickness (T,), which is less than the first thickness (T,), adjacent the second aperture for depositing a second amount of solder material (,) within the second aperture (,) onto a desired surface mount pad (,) of the circuit board (,).