The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2001
Filed:
May. 06, 1999
Applicant:
Inventors:
Noriaki Yamamoto, Fujisawa, JP;
Yukinori Taneda, Yokohama, JP;
Hirohisa Yamamura, Hitachioota, JP;
Akio Yasukawa, Kashiwa, JP;
Osamu Suzuki, Niihari-gun, JP;
Tatsuya Shigemura, Hitachinaka, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A wire bonding method and apparatus implement the flatly thinner plastic deformation for the joint section of a wire, which has a diameter ranging 100-600 &mgr;m, on its feed side, feed out and position the flatly deformed wire joint section to a target joint surface, and join the wire to it by pressing the positioned wire joint section, with vibration being applied, onto the joint surface with a ultrasonic wire bonder. A high-power semiconductor device fabricated based on this scheme has a long life of wire joints.