The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2001
Filed:
Dec. 24, 1998
Kozo Yoshida, Shizuoka, JP;
Kenichi Sakabe, Shizuoka, JP;
Asahi Kasei Kabushiki Kaisha, Osaka, JP;
Abstract
A method for manufacturing a thick-film conductor circuit. The method of manufacture comprises: employing a conductive substrate which is an aluminum plate processed with basic solution containing zinc; coating the surface of the conductive substrate with a liquid photosensitive resin composition; exposing a portion, in which a resin pattern must be formed, to a high-energy beam; dissolving or dispersion-removing a non-exposed portion of the photosensitive resin composition with developing solution so that a required resin pattern is formed on the conductive substrate; immersing the conductive substrate in plating solution while voltage is applied so that a conductor is formed by electrolytic plating; and removing the conductive substrate.