The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2001

Filed:

Oct. 15, 1999
Applicant:
Inventors:

Chikashi Okayama, Chiba, JP;

Takanori Nakashima, Chiba, JP;

Akira Yamauchi, Chiba, JP;

Jun Saito, Chiba, JP;

Michitaka Sasaki, Chiba, JP;

Assignee:

Chisso Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 8/00 ; C08L 2/300 ; C08L 2/304 ;
U.S. Cl.
CPC ...
C08F 8/00 ; C08L 2/300 ; C08L 2/304 ;
Abstract

A polypropylene composition which contains 0.01 to 5 parts by weight of an olefin (co)polymer (a) having an intrinsic viscosity of 15 to 100 dl/g, 100 parts by weight of a propylene homopolymer (b) having an intrinsic viscosity of 0.2 to 10 dl/g, and 28 to 300 parts by weight of an ethylene/propylene copolymer (c) having an intrinsic viscosity of 0.2 to 10 dl/g, and in which the ratio of the melt flow rate of the homopolymer (b) to that of the copolymer (c), MFR,/MFR,, is 0.3 to 4 and the product of the ratio of the intrinsic viscosity of the copolymer (c) to that of the homopolymer (b), [&eegr;],/[&eegr;],, and the weight ratio of the amount of the homopolymer (b) to that of the copolymer (c), W,/W,, is in the range of from 0.2 to 3.0. The composition has high melt tension, high crystallization temperature, and excellent thermal stability, and yields a molded article having excellent transparency, reduced molding shrinkage, and excellent resistance to whitening by impact or bending.


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