The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2001
Filed:
Jan. 06, 1999
Applicant:
Inventor:
Yuichi Yoshida, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ; H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ; H01L 2/334 ;
Abstract
There is provided a method of manufacturing a semiconductor device that ensures the connection state and enhance structural stability, reliability and heat-radiation performance. In a first step, metal bumps are joined to one of electrodes on a semiconductor chip and connection pads on a board. In a second step, the semiconductor chip is adhered to join means. In a third step, join means is joined with the board for connecting the metal bumps with the electrodes or the connection pads.