The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2001
Filed:
Jan. 31, 2000
Hsiao Che Wu, Chung-Li, TW;
Other;
Abstract
The present invention provides a CMP device with a pressure-controlling mechanism comprising a rotating polishing plate, a slurry supplying system for supplying slurry, a rotating carrier that holds and rotates a silicon wafer such that the wafer surface is polished against the rotating polishing plate and the slurry during a CMP process, and a pressure-controlling mechanism capable of exerting different pressures to different locations on the wafer in response to different polishing rates corresponding to each of the specified locations. By utilizing the CMP device according to the present invention, the polishing rate and finish quality at different locations of the silicon wafer will be more uniform, which in turn contributes to an improved wafer planarizing effect.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile