The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2001
Filed:
Aug. 23, 1999
Patrik Zeiter, Zürich, CH;
Heinz Oster, Feuerthalen, CH;
Abstract
Process for manufacturing cold formed shaped packaging having at least one recess made from a metal-plastic laminate,. Examples of such shaped forms of packaging are the base parts of push-through packs or blister packs. The process is such that the laminate,is held between a retaining tool,and a die,. The die,exhibits at least one opening,and a stamping tool,is driven into the die opening,causing the laminate to be shape-formed into the said packaging and, correspondingly, exhibiting one or more recesses. The die,and the retaining tool,exhibit facing edge regions,, and within the edge region,the die,exhibits a shoulder region,that surrounds the die opening,or openings,. The surface of the shoulder region,lies 0.01 to 10 mm lower than the surface of the edge region,of the die,. A first stamping tool with low-friction shape-forming surface forms the metal-plastic laminate in one or more steps down to 100% of the final depth of the recess and subsequently the same or a second stamping tool,likewise with low-friction shape-forming surface effects the final forming of the pre-formed laminate,in one or more steps to at least 100% of the final depth of the recess.