System and method for generating wire bond fingers

Abstract

Chip carrier topology including a plurality of bond lines radiating from a line of chip pads to at least one of zero or more finger lines and zero or more voltage lines is defined by first collecting topology parameters selected from the set including the number of rows of fingers; the spacing between rows of fingers; finger style, said finger style being one of arc-of-circle, constant-bond-length, and encompassing-rectangle; location of voltage rings; value of voltage rings; location of chip pads; voltage of chip pads; dimensions of output fingers; minimum finger pair spacing; maximum finger angle with respect to its bond line; minimum spacing of bond line terminations at voltage rings; and minimum spacing of bond line terminations with respect to and adjacent bond line which terminates at a finger. A plurality of possible topology solutions are generated, and a single possible topology solution selected for further processing. From the single possible solution, a topology solution is generated by placing a middle finger with respect to a middle chip pad, processing alternative chip pads to the right and left sequentially from the middle chip pad selectively to position ring intercepts, inner row fingers and outer row fingers. The topology solution thus generated is evaluated and if acceptable, the result is output to an output file; if not acceptable for failure to conform to all topology parameters, the topology parameters are adjusted and the topology solution generated anew.