The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2001

Filed:

Jul. 09, 1999
Applicant:
Inventors:

Joseph Logan, Jamestown, RI (US);

Robert Tompkins, Millbrook, NY (US);

John R. Miller, Wappingers Falls, NY (US);

Assignee:

Dorsey Gage, Inc., Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02N 1/300 ;
U.S. Cl.
CPC ...
H02N 1/300 ;
Abstract

An electrostatic chuck is formed by: providing a conductive base member; machining a pattern of ridges in the top surface of the base member; providing through holes in the base member; inserting insulated contact posts into through holes and joining same to the base member in such manner that the contact posts extend above the top surface of the base member; depositing a first insulating layer over the base member top surface, ridges and the contact posts, the thickness of the insulating layer being less than the height of the contact posts above the base member surface; removing the first insulative layer from the top of the contact posts and removing a portion of the contact posts in such manner that the contact posts are flush with the surrounding first insulating layer; depositing a conductive layer over the first insulating layer and the tops of the contact posts, the thickness of the conductive layer being approximately the height of the ridges; grinding the top surface of the base member flat to the point of exposing the first insulating layer over the ridges to form separate electrodes; depositing a second insulating layer over the conductive layer and first insulating layer; and, joining the conductive base member to a supporting frame.


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