The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2001
Filed:
Jul. 10, 1998
Kia Silverbrook, Sydney, AU;
Skyerbrook Research Pty Ltd, Balmain, AU;
Abstract
A method of manufacturing an ink jet printhead which comprises the step of providing an initial semiconductor wafer having an electrical circuitry layer formed thereon. The circuitry layer is etched to define a nozzle cavity area. A first material layer is deposited and etched for vias through the first material layer for electrical interconnection of subsequently deposited layers with the circuitry layer. A conductive material layer is deposited on the first material layer and etched to form a heater pattern. A second material layer having a high coefficient of thermal expansion is deposited on the conductive material layer. The second material layer is etched to define an ink ejection port. The wafer is etched to define a nozzle chamber. An ink supply channel is etched through the wafer to be in fluid communication with the nozzle chamber.