High density electrical interconnect system having enhanced grounding and cross-talk reduction capability

Abstract

The present invention provides an electrical interconnect system using multiple grounding methods to reduce or prevent spurious signals from interfering with high density contacts carrying high speed transmissions. A first connector includes an insulative pillar partially surrounded by a plurality of signal contacts. A central ground contact is at least partially located within the insulative pillar. A second connector includes a plurality of flexible signal contacts for mating with the signal contacts adjacent the insulative pillar. Additionally, flexible ground contacts in the first connector are in contact with an electrically conductive shield. The second connector also includes a central ground contact for receiving the central ground contact of the first connector. The ground contacts provide a first method of providing a ground path to reduce spurious signals from entering the signal path. The electrically conducting shield is located outside the signal contacts when the first and the second connectors are mated. The electrically conducting shield is a conductive path to ground. The electrically conductive shield has a plurality of openings through which the signal contacts and the insulative pillar extend when the first connector and the second connector are in a mated condition. The first connector includes a member which provides a ground path between the first connector and the electrically conducting shield. Advantageously, the electrical interconnect system can use multiple grounding methods which are particularly important in a high density electrical interconnect system where the contacts are closely spaced and susceptible to noise and other spurious signals.