The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2001
Filed:
Apr. 25, 2000
Eiji Koketsu, Aichi-ken, JP;
Naoki Ohashi, Aichi-ken, JP;
Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho, Aichi-ken, JP;
Abstract
A through anchor in which residual stress caused by thermal contraction is dispersed so as to reduce risk of crack formation in a resin molding portion. The through anchor includes a metal plate and a resin molding portion covering a portion of the metal plate. Usually, residual stress due to thermal contraction (shrinkage) differences between the resin molding portion and the metal plate is high in regions near both ends of the boundary between the resin molding portion and the metal plate. A notch portion is formed in each of the regions so as to expose a portion of the outer peripheral portion of the metal plate covered by the resin molding portion to the outside environment. Accordingly, although the resin molding portion thermally contracts after insert molding, the contraction of the resin molding portion is not retarded as much by the outer peripheral portion of the metal plate due to the outer peripheral portion of the metal plate being exposed. As a result, the risk of crack formation in the resin molding portion is reduced in this region.