The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2001
Filed:
Sep. 23, 1999
Kiyohumi Yamamoto, Minamiashigara, JP;
Fuji Photo Film Co., Ltd., Kanagawa-Ken, JP;
Abstract
A bonding apparatus for bonding a component on a board at a predetermined position thereon has a displacement mechanism for displacing a board holding unit for holding a board and a component holding unit for holding a component relatively to each other to reach a bonding position, a laser distance measuring mechanism for measuring a distance of said board holding unit or said component holding unit from said bonding position directly with a laser beam, and an imaging mechanism for detecting a position of said component with cameras and positionally correcting the component if necessary. The bonding apparatus allows components, i.e., LED chips, to be positioned highly accurately without being affected by spaced intervals between the components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile