The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2001
Filed:
Dec. 13, 1999
Applicant:
Inventors:
Hiroyuki Juso, Gose, JP;
Yoshiki Sota, Nara, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A resin overmolded semiconductor device includes an insulative substrate having a plurality of first through-holes, interconnection patterns provided on a chip-side surface of the insulative substrate, external connection terminals provided on the opposite surface of the insulative substrate, a semiconductor chip mounted on the chip-side surface, and a sealing portion. The insulative substrate is further formed with a plurality of second through-holes each having one end which is open on the opposite surface, and has second lands which cover the other ends of the second through-holes on the chip-side surface.