The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2001
Filed:
Jun. 15, 1999
Yuichi Yoshida, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
The object of the present invention is to provide a stacked semiconductor device which can diffuse heat generated by the semiconductor chip in the module substrate, other semiconductor chips, the mother board, and the radiator plate, and can prevent needless increases in the temperature of an operating semiconductor chip; in order to achieve this object, the stacked semiconductor device of the present invention comprises a mother board and a module-stacked body mounted on the mother board, the module-stacked body comprising staked two or more modules each of which comprises a module substrate and a semiconductor chip mounted to the module substrate, wherein at least one radiator hole is formed in each of the module substrates and the mother board so that the radiator hole faces to the semiconductor chips.