The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2001

Filed:

Mar. 18, 1997
Applicant:
Inventors:

Shigeki Tanaka, Hakodate, JP;

Atsushi Fujisawa, Hakodate, JP;

Souichi Nagano, Kamiiso-gun, JP;

Tsugihiko Hirano, Hakodate, JP;

Ryouichi Oota, Kameda-gun, JP;

Takafumi Konno, Hakodate, JP;

Kenichi Tatebe, Hakodate, JP;

Toshiaki Okamoto, Hakodate, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract

There is provided a semiconductor chip mounting area for mounting a semiconductor chip, and the points of the inner leads are made to come closer to the semiconductor chip mounting area by arranging the points of the inner leads at equal intervals over the whole periphery of the semiconductor chip mounting area. The points of the inner leads are arranged along the whole periphery of the semiconductor chip mounting area, and the lead pitch at the points of the inner leads corresponding to a corner portion of the semiconductor chip mounting area is made wider than the lead pitch of the other inner lead points.


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