The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2001
Filed:
Apr. 29, 1999
Applicant:
Inventors:
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/350 ; H01L 2/5065 ; H01L 2/352 ; H01L 2/156 ;
U.S. Cl.
CPC ...
H01L 2/350 ; H01L 2/5065 ; H01L 2/352 ; H01L 2/156 ;
Abstract
In a semiconductor device, semiconductor chips are mounted on two surfaces of a die pad. A lower one of the semiconductor chips has a portion projecting outward from an upper one of the semiconductor chips. The semiconductor chips are connected to integrally molded external connection leads trough wiring members. The lower semiconductor chipping the outwardly projecting portion has, on its surface on the same side as an upper surface of the upper semiconductor chip, pads to be connected to the external connection leads. A semiconductor device lead frame and a method of manufacturing the same are also disclosed.