The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2001

Filed:

May. 05, 1999
Applicant:
Inventors:

Masaya Nakatani, Takarazuka, JP;

Yuji Yagi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 1/508 ;
U.S. Cl.
CPC ...
G01P 1/508 ;
Abstract

An acceleration sensor made available without using a high-level semiconductor technology or a micro-machining technology. The sensor detects an acceleration with a high precision, yet the manufacturing cost is inexpensive. In the sensor, a silicon substrate (,) is used only for a portion with which a strain is caused by an acceleration, while an auxiliary substrate (,A,,B), a cap (,A,,B) and a mass substance (,A,,B) are formed of glass material. Joining of the silicon substrate (,) to the mass substance (,A,,B) and the auxiliary substrate (,A,,B), and the auxiliary substrate (,A,,B) to the cap (,A,,B) are made by direct bonding.


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