The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2001

Filed:

May. 31, 2000
Applicant:
Inventors:

Gerd Andler, Frankfurt, DE;

Jens-Peter Heinss, Dresden, DE;

Klaus Goedicke, Dresden, DE;

Christoph Metzner, Pappritz, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D 5/310 ;
U.S. Cl.
CPC ...
B21D 5/310 ;
Abstract

A plain bearing overlay (,) of which exhibits properties which are markedly improved with regard to wear resistance in comparison with overlays applied by electroplating and conventional electron beam vapor deposition methods. The surface of the overlay (,) comprises round raised portions (,) and depressed portions (,), wherein, in relation to the horizontal section plane (,), the raised portions (,) cover a proportion of the surface area amounting to 30% to 50%, based on the entire surface area of the plain bearing, the section plane (,) being at a height at which the total proportion of the surface area consisting of the raised portions (,), and obtained in vertical section, is equal to the total corresponding proportion consisting of the depressed portions (,). The round raised portions exhibit a diameter D of 3 to 8 &mgr;m, in plan view, wherein, in the case of raised portions (,) and depressed portions (,) which in plan view are not circular, this value relates to the maximum diameter. The surface exhibits a roughness of R,&equals;3 to 7 &mgr;m. The method of producing such plain bearings is based on electron beam vapor deposition, wherein a backing member with a roughness of R,23 2 &mgr;m is used and vapor deposition of the overlay is effected at a pressure <0.1 Pa.


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