The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2001

Filed:

Mar. 20, 1998
Applicant:
Inventors:

Yuji Iseki, Kanagawa, JP;

Keiichi Yamaguchi, Kanagawa, JP;

Mitsuo Konno, Kanagawa, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04B 1/38 ;
U.S. Cl.
CPC ...
H04B 1/38 ;
Abstract

A microwave transmitter/receiver module has a package that includes a high-frequency circuit board and an electromagnetically narrowed space. A semiconductor chip is mounted on the circuit board and is contained in the electromagnetically narrowed space. The electromagnetically narrowed space has a cutoff frequency that is higher than a carrier frequency for microwave communication. A receiver antenna pattern is formed on the top surface of the package and is electromagnetically connected to the semiconductor chip through a first slot. A transmitter antenna pattern is formed on the top surface of the package at a different position from the receiver antenna pattern and is electromagnetically connected to the semiconductor chip through a second slot. Since the antenna patterns are on the top surface of the package, the proper performance thereof is secured and the package is compact.


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