The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2001

Filed:

Nov. 05, 1998
Applicant:
Inventors:

Kazuhiro Inoguchi, Toyota, JP;

Nobuei Ito, Chiryu, JP;

Tadashi Hattori, Okazaki, JP;

Yutaka Hattori, Okazaki, JP;

Masahiko Osada, Hekinan, JP;

Assignee:

Nippondenso Co., Ltd., Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 1/62 ;
U.S. Cl.
CPC ...
H01J 1/62 ;
Abstract

A thin-film EL display panel which has excellent packageability, high reliability and stable performance characteristics, and which can prevent nonuniformity of brightness and color from occurring and a fabrication method thereof are provided. In the above thin-film EL display panel, two thin-film EL elements,and,formed by sequentially laminating first electrodes,and,, first insulating layers, luminescent layers, second insulating layers and second electrodes,and,respectively on glass substrates,and,are laminated into position and connecting terminal portions,and,for connecting the first electrodes,and,and second electrodes,and,are formed on the edge portions of the substrates,and,of the thin-film EL elements,and,. connecting pad portions,and,which correspond respectively to the connecting terminal portions,and,of the thin-film EL element,are provided on the edge portions on the substrate of the thin-film EL element,, the connecting pad portions are connected to the connecting terminal portions of the other thin-film EL element via conductive coupling sections,and the connecting pad portions and the connecting terminal portions to which lead wires are connected are provided on the edge portion of one substrate at a position where both substrates will not be laminated.


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